coretechnologies_title
core technologies | research & development | rohm semiconductor-凯发线上登陆下载网址
rd_navi
coretechnologies_main
- power electronics
- sensor technology
- ai
power electronics
technology that contributes to guaranteeing stable operation of instrumentscomparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
research areas
- ・semiconductor packaging
- ・design for reliability
presented papers
introductory video
comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
the technology that contributes to cost reduction of power amplifiersdeep-donor-induced suppression of current collapse in an algan-gan heterojunction structure grown on si
research areas
- ・power electronics
presented papers
introductory video
deep-donor-induced suppression of current collapse in an algan-gan heterojunction structure grown on si
technology that contributes to energy saving by improvement of performancea method for measuring the characteristics of power transistors in the real operating range
research areas
- ・power transistor
- ・device characterization
- ・device modeling
presented papers
introductory video
a method for measuring the characteristics of power transistors in the real operating range
technology that contributes to noise suppression in the development of power electronics circuits magnetic near-field strength prediction of a power module by measurement-independent modeling of its structure
research areas
- ・electromagnetic simulation
- ・power modules
presented papers
introductory video
magnetic near-field strength prediction of a power module by measurement-independent modeling of its structure
simulation environment development for power devices and modulesaccurate prediction of how power system works
research areas
- ・device modeling, circuit simulation, double pulse test, power module
- ・electro-thermal co-simulation
device modeling and power module modeling
electro-thermal co-simulation
presented papers
“ultra small* , cool well”transfer molded sic power module
*august, 2018 rohm survey
features
- ・the industry’s lowest*1 thermal resistance*2
- ・ultra-compact, lightweight
- ・high power density : 15kw/cm3
- *1：august, 2018 rohm survey
- *2：with the same chip size, board size, and cooling capacity
applications
- ・automotive high-power dc/dc converters
- ・main drive inverters in vehicles
appearance
thermal resistance (rthj-w)
max. junction temperature comparison
sic modules contribute to wireless power supply for in-wheel motors while drivingenabling direct wireless charging while driving significantly extends ev travel range (to nearly infinity in theory)
joint development with the fujimoto laboratory at tokyo university and several other companies
sic application demonstration3-phase 50kw bidirectional inverter utilizing sic devices
features
- ・demonstration of a 3-phase bidirectional inverter that delivers over 99% (max) efficiency
- ・achieves 50kw output utilizing discrete devices
- ・achieves 1.8x the output power of the previous 30kw inverter demo
applications
- ・grid-connected energy storage systems
- ・uninterruptible power systems
- ・power circulating load equipment
overview
sic devices
circuit configuration
characteristics
performance
2mhz/120w dc/dc converter using gan-fet2mhz/120w dc/dc converter
features
- ・small size
- ・large power density
applications
- ・base station power systems
- ・server power systems
circuit configuration
specification
power conversion efficiency comparison
power density
reliability design for electronic packagesdeformation behavior analysis of electronic materials and packages
research areas
- ・mate rials : sintered silver, solder, resin
- ・materials characterization : film tensile test, stress-strain curve, thermal deformation, finite element method
research example1 : mechanical behaviors of sintered porous silver films
research example2 : for designing reliable packages
presented papers
sensor technology
non-slam “autonomous mobile robot technology without map”nomadbot™ –no map driving robot-
features
- ・amr (autonomous mobile robot)
- ・reaches its destination even in a changing layout
- ・simple low-cost structure
- ・available immediately after purchase: requires no extra time, expertise, or technology for implementation
- ・equipped with echolocation technology: achieves spatial recognition through ultrasonic waves
design concepts
- ・travel straight to the destination while avoiding obstacles along the way
- ・cheap, easy, trouble-free
markets
- ・smes (small- to medium-sized enterprises) unable to take the risk of cost and time for implementation
- ・factories that do not require advanced system integration
- ・construction sites with frequent layout changes
- ・environments with mirrored equipment, glass walls, and/or special lighting not ideal for lidar or cameras
terminology
-slam(simultaneous localization and mapping)
a technology for building a map while keeping track of location at the same time
-echolocation
a technique used by animals to determine the distance, direction, and size of objects by emitting sounds or ultrasonic waves and detecting their reverberation.
introductory video
cost-effecti©ve way to develop next-generation quantum devicesobservation of luminescence of the si-vacancy defects created in a bulk sic substrate
research areas
- ・magnetic sensing
- ・temperature sensing
- ・single-photon sources
presented papers
compact, lightweight, room-temperature, antenna-integrated terahertz oscillators and detectorsterahertz resonant tunneling diodes
features
- ・compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (rtd)
- ・high speed switching
(operable for over 25gbps direct modulation and detection)
applications
- ・non- destructive inspection (i.e. internal materials, moisture, metals)
- ・security systems
- ・medical, bio sensor
- ・ultra-high-speed wireless communication
size comparison with an existence thz source
broadband operation and sensitive detection
selectable permeability enables internal inspection
ultra-high speed wireless communication
the technology satisfying the competing operation of ultra-short pulse and high powerld module for lidar
features
- ・ultra-short pulse (<5ns) operation compatible with high laser power (100w to 200w)
- ・surface mounting resin-mold package
- ・ld, fet, and capacitors integrated in a compact package
applications
- ・autonomous driving
- ・range finding
- ・industrial robots
low-inductance design is the key for ultra short pulse high-power laser
development roadmap
typical characteristics of the ld module
circuit diagram and appearance
compact limiting current type oxygen / humidity sensorminiaturized oxygen and humidity sensor
features
- ・controls the gas flow rate utilizing a porous oxide thin film
- ・utilizes an ultra-high temperature micro hot plate which exhibits long term reliability
- ・high durability, low power consumption
applications
- ・in-vehicle humidity management
- ・measurement of the humidity of air flowing into internal combustion engines
sensor structure
specifications (targets)
current generation process
sensing characteristics
mems actuators and transducersmems devices utilizing thin-film piezo technology
research areas
- ・conducted studies on high efficiency piezoelectric thin films
- ・carried out r&d on electronic devices utilizing thin-film piezo technology
- ・analyzed the operation and failure modes of piezo devices and implemented research into high reliability prediction technology based on the finite element method (fem)
piezoelectric thin-film reliability technology
ai
automatic detection methodageing monitoring of gan transistors using recurrent neural networks
research areas
- ・reliability
- ・machine learning
introductory video
ageing monitoring of gan transistors using recurrent neural networks